Modified epoxy resin composition
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United States of America Patent
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Feb 1, 1983
Grant Date -
N/A
app pub date -
Dec 22, 1981
filing date -
Dec 29, 1980
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Modified epoxy resin composition having excellent flexibility and excellent compatibility with conventional epoxy resins as well as the original properties of the epoxy resin before modified such as mechanical strength, adhesion, heat resistance and chemical resistance, which is obtained by treating an epoxy resin with at least one modified adduct [D] of a conjugated diene polymer or copolymer which has an imido bond and/or amido bond and a semi-ester structure and has an acid value owing to a free carboxyl group of 5 to 100, said modified adduct being obtained by reacting an adduct [A] of a polymer of a conjugated diene having a number average molecular weight of 300 to 20,000 or a copolymer of the conjugated diene and a vinyl monomer with an .alpha.,.beta.-unsaturated dicarboxylic acid or its anhydride, with a compound [B] of the formula: ##STR1## and a compound [C] of the formula: R.sub.3 --CH.sub.2).sub.m OH [II].
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