Pi pad attenuator
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United States of America Patent
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-
Sep 14, 1982
Grant Date -
N/A
app pub date -
Jul 14, 1978
filing date -
Jul 14, 1978
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A pi pad attenuator for microwave systems is formed on an insulating substrate in the form of a small card or chip. Resist material covers the substrate, and input and output conductors are plated over the resist in the desired configuration. Resist material is removed to leave conductors interconnected in a predetermined pattern by individual sections of resist to form the pi pad. Characteristics of the attenuator are determined by the area of the remaining resist sections and/or the thickness of the applied resist.
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