Silicon wafer steam oxidizing apparatus
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United States of America Patent
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Feb 16, 1982
Grant Date -
N/A
app pub date -
Jun 27, 1980
filing date -
Jun 27, 1980
priority date (Note) -
Expired
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Abstract
A high-pressure, high-temperature gaseous chemical apparatus particularly designed for oxidation of silicon wafers and providing for pressure equalization across the wall of the vessel providing the reaction chamber, for a water boiling enclosure within the reaction chamber and the injection of liquid water under pressure into the enclosure and for the continuous flow through of water vapor at high temperature and high pressure in the reaction chamber while maintaining the aforementioned pressure balance.
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