Equipment for continuous plating
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United States of America Patent
Stats
-
Jul 21, 1981
Grant Date -
N/A
app pub date -
Dec 17, 1979
filing date -
Dec 15, 1978
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Device for selective electrodeposition of metal flat stock, on laddered or bandoliered component strips having at least one station filled with electrolyte through which the component strips are transported lengthwise. The device includes a longitudinal guide means for the component strips-the guide means is provided with a slot shaped chamber. The chamber, at its lower side is in open contact with a plating bath filled with electrolyte on a level lower than the electrolyte level in the plating bath. The guide means has apertures for introducing pressurized gas or air. The plating bath contains tubes with holes in such a position that during operation electrolyte recirculated through a transport pump can be jetted onto the portion of the metal or component strip which extends below the slot-shaped chamber of the guide means into the electrolyte.
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