Method for coating the edge of a printed circuit board to improve its moisture resistance
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United States of America Patent
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-
Jul 14, 1981
Grant Date -
N/A
app pub date -
May 19, 1980
filing date -
May 19, 1980
priority date (Note) -
Expired
status (Latency Note)
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Abstract
By sealing the periphery of a printed circuit board, the previously exposed edges of the board are substantially prevented from moisture wicking. This sealing of the periphery can be made concurrently with the plating of through-holes on the board. With this process, current leakage paths due to board moisture wicking within the board is significantly reduced.
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