Phenolic resins with improved low temperature processing stability
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United States of America Patent
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Apr 21, 1981
Issued Date -
N/A
app pub date -
Dec 28, 1979
filing date -
Apr 13, 1979
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Phenolic novolak resins are described which are structurally characterized as having from about 55% to about 90% of the available theoretical paraphenyl linkages in the resin chain bridged to a phenyl group. The resin compositions of this invention provide extended resin stability at relatively low temperatures without significant adverse affect on the cure speed at the molding temperature. The resins are especially suited for use in runnerless injection or cold manifold molding processes, but can also be used in transfer, compression and injection molding processes.
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