TRANSFER METHOD FOR MICRO FLIP CHIPS
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Apr 14, 2023
filing date -
Apr 14, 2023
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Abstract
A transfer method for micro flip chips includes forming a first bonding member on a surface of one side of a second electrical connection piece of each of a plurality of micro flip chips facing away from a temporary substrate to which they are adhered. The micro flip chips are transferred onto a drive substrate. The second electrical connection pieces of the micro flip chips are connected to a corresponding one of first electrical connection pieces of the drive substrate via the first bonding members. The micro flip chips are inspected to determine bad point positions of defective chips on the drive substrate. The first bonding member is irradiated at each bad point position by laser and the defective chip is removed. The method ensures stable bonding between the micro flip chips and the drive substrate and prevents the first electrical connection pieces from being damaged by laser irradiation.
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