PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250120102A1
SERIAL NO

18984426

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Package substrates with components included in cavities of glass cores are disclosed. An example apparatus includes: a glass core having a first opening and a second opening spaced apart from the first opening, the second opening having a greater width than the first opening. The example apparatus further includes a conductive material adjacent a first wall of the first opening; and a dielectric material adjacent a second wall of the second opening.

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Patent Owner(s)

Patent OwnerAddress
INTEL CORPORATION2200 MISSION COLLEGE BOULEVARD SANTA CLARA CA 95054

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bryks, Whitney Tempe, US 37 9
Duan, Gang Chandler, US 322 1216
Ecton, Jeremy Gilbert, US 84 33
Gamba, Jason Gilbert, US 9 13
Hariri, Haifa Phoenix, US 9 20
Kandanur, Sashi Shekhar Phoenix, US 7 0
Marin, Brandon Christian Gilbert, US 34 5
Peoples, Joseph Gilbert, US 3 4
Pietambaram, Srinivas Venkata Ramanuja Chandler, US 84 5
Rahman, Mohammad Mamunur Gilbert, US 23 2
Shan, Bohan Chandler, US 58 6
Stacey, Joshua James Chandler, US 1 0
Tanaka, Hiroki Gilbert, US 403 2433
Vehonsky, Jacob Ryan Chandler, US 1 0

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