HEAT SINK FOR A SOLID-STATE CIRCUIT BREAKER IN AN ELECTRICAL PANEL

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250120049A1
SERIAL NO

18987280

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A solid-state circuit breaker includes an airgap operating mechanism including components and electronics including semiconductors and software algorithms that control the power and can interrupt extreme currents. The SSCB further includes a housing that houses the components of the airgap operating mechanism and the electronics. The housing of the solid-state circuit breaker includes a heat sink that is part of an outer molded case such that a plastic part of the heat sink is over-molded onto a heat conducting piece that is directly connected to the semiconductors of the solid-state circuit breaker. The plastic part and the heat conducting piece are to be separated into two or more parts if the semiconductors are located at different locations on a printed circuit board such that a thermal bridge to conduct heat between the two or more parts and eventually to a plurality of fins external to the solid-state circuit breaker.

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Patent Owner(s)

Patent OwnerAddress
SIEMENS INDUSTRY INC100 TECHNOLOGY DRIVE ALPHARETTA GA 30005

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ferree, James Edward Lawrenceville, US 14 40
Titus, Solomon R Cumming, US 15 158
Yang, Guang Johns Creek, US 457 5004

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