Contact Hole Assembly and Electronic Device
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Oct 2, 2024
filing date -
Oct 2, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
Embodiments of the disclosure relate to a contact hole assembly and an electronic device and may, more specifically, provide a contact hole assembly comprising a first metal layer to which an electrical signal is input, an insulation layer formed on the first metal layer, a second metal layer formed on the insulation layer and outputting the electrical signal, and a contact hole electrically connecting the first metal layer and the second metal layer, wherein the contact hole includes a via area penetrating the insulation layer, a conductor formed in the via area, and a recess area where a portion of a surface of the conductor is removed.
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