CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
N/A
Issued Date -
Apr 10, 2025
app pub date -
May 31, 2024
filing date -
May 31, 2024
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A circuit board including a substrate having a first surface and a second surface facing each other, including an insulating layer disposed between the first surface and the second surface, and having a cavity penetrating in a direction perpendicular to the first surface, a first wiring pattern embedded in the insulating layer on the first surface to enable signal transmission, and a first reinforcement pattern embedded in the insulating layer on the first surface, disposed around the cavity to be spaced apart from an edge of the cavity, and configured to be separated from the first wiring pattern.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully