MODULATOR INTEGRATED CIRCUIT PACKAGE
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Oct 6, 2023
filing date -
Oct 6, 2023
priority date (Note) -
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Abstract
A modulator integrated circuit (IC) package comprising: signal modulator circuitry; and power modulator circuitry, wherein the signal modulator circuitry is configured to receive an input signal and to supply a modulated output signal to output stage circuitry external to the modulator IC package, and wherein the power modulator circuitry is configured to control power converter circuitry, external to the modulator IC package, operative to provide a supply voltage to the output stage circuitry.
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