POWER AMPLIFIER MODULE WITH INTERLEAVED WIREBONDS
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Oct 6, 2023
filing date -
Oct 6, 2023
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Abstract
A device includes a Doherty amplifier having a first amplifier die having a first output terminal, and a second amplifier die with a second output terminal. A device may include an output impedance matching network connected to an output terminal of the Doherty amplifier. A device may include an impedance inversion element connected to the second output terminal of the second amplifier die. A device may include a first wirebond array connected between the first output terminal of the first amplifier die and the output impedance matching network. A device may include a second wirebond array connected between the first output terminal of the first amplifier die and the impedance inversion element, wherein wirebonds of the first wirebond array are interleaved with wirebonds of the second wirebond array.
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