ELECTROSTATIC CHUCK
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Sep 20, 2024
filing date -
Sep 20, 2024
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Abstract
An electrostatic chuck (10) includes a dielectric substrate (100), a base plate (200) formed of a metal material, and a bonding layer (300) bonding the dielectric substrate (100) and the base plate (200). At least a portion of the base plate (200) facing the bonding layer (300) is covered with a ceramic film (231), and a surface of the ceramic film (231) is a bonded surface (S). The bonded surface (S) satisfies at least one of a first condition: arithmetic average height (Sa)≤1.5 μm or a second condition: root mean square height (Sq)≤2.0 μm, and at least one of a third condition: maximum valley depth (Sv)≥20.0 μm or a fourth condition: maximum height (Sz)≥20.0 μm.
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