MANUFACTURING METHOD AND MANUFACTURING APPARATUS FOR LIGHT-EMITTING DEVICE AND LASER ELEMENT SUBSTRATE
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United States of America
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Apr 10, 2025
app pub date -
Feb 9, 2023
filing date -
Feb 9, 2023
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Abstract
A manufacturing method for a light-emitting device, the manufacturing method including: preparing a first substrate provided with a plurality of light-emitting bodies; preparing a second substrate including a first bonding portion having conductivity, a first pad portion electrically connected to the first bonding portion, and a first solder regulating portion located between the first bonding portion and the first pad portion, the second substrate including a solder formed on the first bonding portion; bonding a first object selected from the plurality of light-emitting bodies to the second substrate with the solder; and transferring the first object to the second substrate by separating the first substrate and the second substrate from each other.
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