BUS CONNECTION WIRE FORWARD SOLDERING STRUCTURE
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Nov 30, 2023
filing date -
Nov 30, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
A bus connection wire forward soldering structure includes a circuit board, a flat cable and a fixing member, and the circuit board has a solder area, a docking area, first and second surfaces and an outgoing line direction. The solder area is disposed on the first surface, the flat cable includes a solder terminal, first and second attaching sections, a folding section and a main body section, the solder terminal faces the docking area and is electrically connected to the solder area, the folding section is connected between the first and second attaching sections, the main body section extends along the outgoing line direction, the fixing member covers the solder terminal, the folding section, the first and second attaching sections, the fixing member has a notch defined corresponding to the second surface and located at junction of the second attaching section and the main body section junction.
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