MULTILAYER RADIO FREQUENCY COMPONENT
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Oct 6, 2023
filing date -
Oct 6, 2023
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Abstract
A radio frequency (RF) component having a compact form-factor includes a planar transmission line located between first and second dielectric substrates. A first plurality of conductive vias integrated with the first substrate are electrically connected to a second plurality of conductive vias integrated with the second substrate, wherein the electrically connected conductive vias are arranged at least partially about the planar transmission line. The vias are connected to a ground plane on one of the substrates. Multiple RF components can be stacked one atop the other to form an integrated bank of discrete or electrically connected electrical devices implemented as antennas, couplers and filters, among other RF components, and combinations thereof.
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