SEMICONDUCTOR PACKAGE WITH SHARED BARRIER LAYER IN REDISTRIBUTION AND VIA
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Dec 16, 2024
filing date -
Dec 16, 2024
priority date (Note) -
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Abstract
A package structure includes first and second dies, an insulation structure, a through via, a dielectric layer and a redistribution layer. The second die is electrically bonded to the first die and includes a through substrate via. The insulation structure is disposed on the first die and laterally surrounds the second die. The through via penetrates through the insulation structure to electrically connect to the first die. The redistribution layer is embedded in the dielectric layer and electrically connected to the through via, and the redistribution layer includes a barrier layer and a conductive layer. The conductive layer of the redistribution layer continuously extends between opposite surfaces of the dielectric layer, and a conductive post of the through via extends from the surface of the dielectric layer towards the first die, and the conductive layer of the redistribution layer is separated from the through substrate via by the barrier layer.
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