APPARATUS AND METHODS FOR TOOL MARK FREE STITCH BONDING
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Nov 6, 2024
filing date -
Nov 6, 2024
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Abstract
Apparatus and method for tool mark free stich bonding. In some embodiments, a method for wire bonding can include feeding a wire through a capillary tip and attaching a first end of the wire to a first location, thereby forming a ball bond. The method can further include moving the capillary tip towards a second location while the wire feeds out of the capillary tip. The method can further include attaching a second end of the wire to the second location while preventing contact between the capillary tip and the second location, thereby forming a stitch bond without a tool mark at the second location.
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