PACKAGE STRUCTURE AND METHODS OF FORMING THE SAME
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Jul 29, 2024
filing date -
Jul 29, 2024
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Abstract
A package structure includes a package substrate, a chip on the package substrate, a package lid on the chip, and a structure between the chip and the package lid. The structure may include a thermal interface material (TIM) layer, and a metal layer between the TIM layer and at least one of the chip or the package lid and configured to inhibit formation of an intermetallic compound (IMC) layer. A method of making the package structure includes forming a metal layer including a high-texture structure on at least one of a chip or a package lid, attaching the chip to a package substrate, forming a thermal interface material (TIM) layer over the chip, and attaching the package lid to the package substrate over the chip so that the chip, the TIM layer and the metal layer are disposed between the package lid and the package substrate.
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