ELECTRONIC FUSE VIA AND LOGIC DEVICE CO-INTEGRATION WITH BACKSIDE POWER DELIVERY NETWORK

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250118660A1
SERIAL NO

18482213

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Abstract

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A semiconductor structure includes an electronic fuse via having a positive tapered shape extending from a back-end-of-the-line interconnect to a backside power delivery network. The electronic fuse via comprises a conductive material.

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Patent Owner(s)

Patent OwnerAddress
INTERNATIONAL BUSINESS MACHINES CORPORATIONNEW ORCHARD ROAD ARMONK NY 10504

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Li, Tao Slingerlands, US 743 4256
Loubet, Nicolas Jean Guilderland, US 44 93
Medikonda, Manasa Albany, US 4 0
Xie, Ruilong Niskayuna, US 1683 12538

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