THERMAL CONDUCTIVE BONDING STRUCTURE
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Mar 12, 2024
filing date -
Mar 12, 2024
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Abstract
A method includes forming a bonding structure that contains thermal conductive vias (also termed as thermal vias, thermal conductive pillars, or thermal pillars) on a semiconductor structure. The thermal vias, with material thermal conductivity greater than about 10 W/m·K, are embedded in the bonding structure that provides a quick dissipation path of heat from thermal hotspot regions into a substrate.
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