PACKAGE STRUCTURE INCLUDING A HEAT DISSIPATION STRUCTURE AND METHODS OF FORMING THE SAME
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Feb 26, 2024
filing date -
Feb 26, 2024
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Abstract
A package structure includes a package substrate, an interposer module, a package lid, and a heat dissipation structure between the interposer module and the package lid, including a thermal interface material (TIM) layer, and a metal barrier layer between the TIM layer and at least one of the interposer module or the package lid, and configured to inhibit formation of an intermetallic compound (IMC) layer. A method of making the package structure includes forming a metal barrier layer comprising Cu (111) on at least one of an interposer module or a package lid, attaching the interposer module, forming a thermal interface material (TIM) layer over the interposer module, and attaching the package lid to the package substrate so that the interposer module, the TIM layer and the metal barrier layer are disposed between the package lid and the package substrate, and the metal barrier layer contacts the TIM layer.
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