INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Oct 4, 2023
filing date -
Oct 4, 2023
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Abstract
An interconnection structure and a manufacturing method thereof are provided. The interconnection structure includes a first dielectric layer, a first conductive feature, a second dielectric layer, and a barrier layer. The first conductive feature is disposed on the first dielectric layer, the second dielectric layer is disposed on the first dielectric layer and surrounds the sidewalls of the first conductive feature, the barrier layer is disposed between the first dielectric layer and the second dielectric layer and between the sidewalls of the first conductive feature and the second dielectric layer.
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