METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, RECORDING MEDIUM, SUBSTRATE TRANSFER APPARATUS, AND SUBSTRATE PROCESSING APPARATUS
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Sep 23, 2024
filing date -
Sep 23, 2024
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Abstract
There is provided a technique that includes: by using a substrate transfer apparatus including a mounting stage on which a substrate is placed and a gripper capable of gripping the substrate placed on the mounting stage between a first portion and a second portion, moving the substrate placed on the mounting stage toward the first portion by using the second portion that pushes the substrate with a first external force; and gripping the substrate placed on the mounting stage with a second external force or a third external force by using the first portion and the second portion.
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