TEMPERATURE MEASUREMENT ASSEMBLY, SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Aug 28, 2024
filing date -
Aug 28, 2024
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Abstract
There is provided a technique that enables stable temperature measurement for a long period under a high-temperature environment. It includes (a) an insulating tube with two through-holes, through which two conductive wires of a temperature sensor are respectively inserted, (b) a first protective tube, through which the insulating tube is inserted inwardly from a first end thereof, (c) a cylindrical sleeve airtightly connected to the first end of the first protective tube and airtightly installed to an installation port from an outside of a furnace, and (d) a second protective tube mounted to the installation port from a furnace and covering the entire first protective tube on the inside of the furnace.
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