CHAMBER KITS, PROCESSING CHAMBERS, AND METHODS FOR GAS ACTIVATION IN SEMICONDUCTOR MANUFACTURING
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Dec 20, 2023
filing date -
Dec 20, 2023
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Abstract
Embodiments of the present disclosure relate to chamber kits, processing chambers, and related methods and components for gas activation applicable for semiconductor manufacturing. In one or more embodiments, a processing chamber includes a chamber body and one or more heat sources configured to heat a processing volume of the chamber body. The chamber body includes one or more gas inject passages formed in the chamber body, and one or more gas exhaust passages formed in the chamber body. The processing chamber includes a first pre-heat ring that includes a first opaque surface, and a second pre-heat ring that includes a second opaque surface. The first pre-heat ring and the second pre-heat ring define a first gas flow path between the first opaque surface and the second opaque surface, and the first gas flow path in fluid communication with at least one of the one or more gas inject passages.
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