INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THEREOF
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Dec 17, 2024
filing date -
Dec 17, 2024
priority date (Note) -
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Abstract
A method of forming an integrated circuit package includes attaching a first die to an interposer. The interposer includes a first die connector and a second die connector on the interposer and a first dielectric layer covering at least one sidewall of the first die connector and at least one sidewall of the second die connector. The first die is coupled to the first die connector and to the first dielectric layer and the second die connector is exposed by the first die. The method further includes recessing the first dielectric layer to expose at least one sidewall of the second die connector and attaching a second die to the interposer, the second die being coupled to the second die connector.
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