SELECTIVE PASSIVATION OF PHOTORESISTS
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Oct 10, 2023
filing date -
Oct 10, 2023
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Abstract
A method of processing a substrate includes forming a photoresist layer over the substrate, exposing the substrate to a pattern of an actinic radiation, where the exposing causes a photo-reaction in an exposed portion of the photoresist layer. The method includes treating the photoresist layer with a binding agent, where the binding agent is selectively adsorbed on a first portion of the photoresist layer, and performing a development process to remove a second portion of the photoresist, the first portion remaining after the development process.
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