PLASMA PROCESSING APPARATUS AND HEATING APPARATUS

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250118537A1
SERIAL NO

18279755

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Abstract

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In a plasma processing apparatus using a circularly polarized wave, in order to reduce an influence caused by a reflected wave and to efficiently utilize a circularly polarized wave for a plasma process, the plasma processing apparatus includes a microwave source configured to generate a microwave, a plasma processing chamber configured to process a processing target disposed therein by using plasma generated by the microwave, and a waveguide portion that includes a rectangular waveguide connected to the microwave source and a circular waveguide connected to the plasma processing chamber, and the plasma processing apparatus is further provided with, inside the circular waveguide, a reflected wave generator configured to generate a reflected wave that cancels a reflected wave propagating in the circular waveguide from a plasma processing chamber side in a state where the plasma is generated inside the plasma processing chamber by the microwave.

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Patent Owner(s)

Patent OwnerAddress
HITACHI HIGH-TECH CORPORATION17-1 TORANOMON 1-CHOME MINATO-KU TOKYO 105-6409

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
IKEDA, Norihiko Tokyo, JP 30 137
TAMURA, Hitoshi Tokyo, JP 79 1632

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