ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

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United States of America

APP PUB NO 20250118461A1
SERIAL NO

18983399

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Abstract

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An electronic component includes a base body including a plurality of voids, a protective material covering a part or a whole of an outer surface of the base body, and an external electrode covering a part of an outer surface of the protective material. The protective material is glass containing a silane compound having a carbon chain with 3 or more carbon atoms. The protective material includes a filling portion occupying at least some of the voids, and a film portion covering the outer surface of the base body.

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Patent Owner(s)

Patent OwnerAddress
MURATA MANUFACTURING CO LTDNAGAOKAKYO-SHI KYOTO 617-8555

International Classification(s)

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  • 2024 Application Filing Year
  • C03C Class
  • 397 Applications Filed
  • 17 Patents Issued To-Date
  • 4.29 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HOSHINO, Yuuta Nagaokakyo-shi, JP 22 15
OOSHIMA, Tomoya Nagaokakyo-shi, JP 13 1
TSUBOKAWA, Daisho Nagaokakyo-shi, JP 2 0

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges22100102030405060708090100110120130140150160170180190200210220230240

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