LITHOGRAPHY PROCESS

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United States of America

APP PUB NO 20250116937A1
SERIAL NO

18481124

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Abstract

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A lithography method includes the steps which are mentioned below. A photoresist layer is formed over a substrate. The photoresist layer is exposed. The photoresist layer is developed. A vacuum treatment is performed to the photoresist layer. The substrate is etched by using the photoresist layer as an etch mask.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDNO 8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHANG, Ching-Yu Yilang County, TW 578 7902
HUANG, Hsien-Chung Hsinchu City, TW 7 3
LAI, Wei-Han New Taipei City, TW 71 130
WENG, Ming-Hui New Taipei City, TW 50 58

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