MULTI-LAYERED OPTICAL INTEGRATED CIRCUIT ASSEMBLY WITH A MONOCRYSTALLINE WAVEGUIDE AND LOWER CRYSTALLINITY BONDING LAYER
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Dec 17, 2024
filing date -
Dec 17, 2024
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Abstract
Described herein are stacked photonic integrated circuit (PIC) assemblies that include multiple layers of waveguides. The waveguides are formed of substantially monocrystalline materials, which cannot be repeatedly deposited. Layers of monocrystalline material are fabricated and repeatedly transferred onto the PIC structure using a layer transfer process, which involves bonding a monocrystalline material using a non-monocrystalline bonding material. Layers of isolation materials are also deposited or layer transferred onto the PIC assembly.
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