SEMICONDUCTOR PACKAGE WITH PHOTONICS CHIP
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Sep 17, 2024
filing date -
Sep 17, 2024
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Abstract
A semiconductor package includes an interposer including an interposer optical waveguide, and a plurality of chiplets coupled onto the interposer and each including a semiconductor chip and a photonics chip electrically coupled to the semiconductor chip, wherein the photonics chip includes a photonic integrated circuit configured to input or output an optical signal, and an optical waveguide optically coupled to the interposer optical waveguide.
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