SEMICONDUCTOR PACKAGE INSPECTION DEVICE
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Sep 19, 2024
filing date -
Sep 19, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor package inspection device includes a socket block, a plurality of pin holes in the socket block, a plurality of pogo pins in the plurality of pin holes, a sealing portion extending peripherally around a first pin area of the socket block and in which the plurality of pin holes and the plurality of pogo pins are arranged. The sealing portion protrudes from an upper surface of the socket block. The semiconductor package inspection device includes a support socket, an upper test board, and a handler above the upper test board that has an internal vacuum passageway in fluid communication with a vacuum aperture in the upper test board.
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