ULTRASONIC DETECTION OF VOIDS AND CRACKS IN SUBSTRATES
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
May 31, 2024
filing date -
May 31, 2024
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Abstract
A method of ultrasonic detection of voids and cracks in substrates includes controlling an ultrasonic transducer to generate an acoustic signal applied to the substrate, receiving a reflected acoustic signal detected by an ultrasonic detector, and determining a defect in the substrate based on phase and intensity of the reflected acoustic signal compared to the acoustic signal applied to the substrate.
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