Flex Assemblies for Electronically Coupling Sensors of a Front-Facing Outer Cover of a Head-wearable Device to a Logic Board Thereof, and Methods of Manufacturing Therefor
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Jul 15, 2024
filing date -
Jul 15, 2024
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Abstract
In one aspect, a head-wearable device includes a body with a housing and a plurality of electrical components arranged in the housing, including a logic board. The head-wearable device is detachably couplable to the housing. The front-facing outer cover includes a first set of components mounted to the front-facing outer surface, each respective component of the first set of components comprising a first set of sensors, and a second set of components mounted to the front-facing outer surface, each respective component of the second set of components comprising a second set of sensors. The head-wearable device includes a first set of flex assemblies configured to communicatively couple a respective sensor of the first set of sensors to the logic board. And the head-wearable device includes a second set of flex assemblies configured to communicatively couple respective components of the second set of second set of components to the logic board.
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