A Film Thickness and Temperature Measuring Device and a Measuring Method Using It

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250116508A1
SERIAL NO

18836628

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present disclosure relates to a film temperature and thickness measurement apparatus and a measurement method using the same, which can enable manufacturing of a film with a uniform thickness by sequentially measuring the surface temperature and thickness of a film at the same point of the film that is extruded or coating molded in an in-line method, and through control of the temperature and the thickness of the film based on the measured data.

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Patent Owner(s)

Patent OwnerAddress
LG CHEM LTD128 YEOUI-DAERO YEONGDEUNGPO-GU SEOUL 07336 REPUBLIC OF KOREA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Do Hyun Daejeon, KR 32 17
Lee, Seung Heon Daejeon, KR 125 845

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