PLATING APPARATUS

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250116029A1
SERIAL NO

18985144

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A plating apparatus includes a plating bath in which a plating solution including plating targets is stored and an injector that is in the plating bath and that injects the plating solution. The plating targets included in the plating solution are stirred by the plating solution injected from the injector. The injector has an inner cylindrical shape including a bottom surface extending in a horizontal direction, an inner wall extending in a height direction from the bottom surface, and an opening defined in an upper end of the inner wall. The opening is a first injection port that injects the plating solution to the plating bath. A mesh portion is provided at the first injection port. A second injection port that injects the plating solution to the injector is provided in the bottom surface.

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Patent Owner(s)

Patent OwnerAddress
MURATA MANUFACTURING CO LTD10-1 HIGASHIKOTARI 1-CHOME NAGAOKAKYO-SHI KYOTO-FU 617-8555

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
SHIMADA, Tomokazu Nagaokakyo-shi, JP 11 62

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