PLATING APPARATUS AND PLATING METHOD

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250116027A1
SERIAL NO

18293706

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Provided is a technique capable of improving the stirring force of a plating solution by a paddle. A plating apparatus 1000 includes a paddle 70 disposed between an anode 11 and a substrate Wf. The paddle is configured to reciprocate parallel to the anode in a first direction and a second direction to stir a plating solution Ps. The paddle includes a honeycomb-structure portion 71 provided with a plurality of polygonal through-holes 74. The honeycomb-structure portion has a shape in which a paddle width at a center portion in a third direction which is a direction perpendicular to a reciprocation direction of the paddle is wider than a paddle width at an end portion in the third direction. The honeycomb-structure portion includes a first outer peripheral wall 75 oriented in the first direction. The first outer peripheral wall includes a first center wall 77 disposed at a center portion in the third direction of the first outer peripheral wall, and the first center wall extends in the third direction.

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Patent Owner(s)

Patent OwnerAddress
EBARA CORPORATION11-1 HANEDA ASAHI-CHO OTA-KU TOKYO 1448510

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MASUDA, Yasuyuki Tokyo, JP 40 65

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