PLATING APPARATUS AND OPERATION METHOD OF PLATING APPARATUS
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Dec 20, 2022
filing date -
Dec 20, 2022
priority date (Note) -
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Abstract
To efficiently remove gas bubbles from an entire ionically resistive element. A plating apparatus includes a plating tank (410), a substrate holder (440), an anode (430), an ionically resistive element (450), an agitating member (480), and a driving mechanism (482). The plating tank (410) is configured to contain a plating solution. The substrate holder (440) is configured to hold a substrate (Wf) with a surface to be plated facing downward. The anode (430) is disposed in the plating tank (410). The ionically resistive element (450) is disposed between the substrate (Wf) and the anode (430). The agitating member (480) is disposed between the substrate (Wf) and the ionically resistive element (450). The driving mechanism (482) is configured to reciprocate the agitating member (480) along the surface to be plated of the substrate (Wf). The driving mechanism (482) is configured to perform a first gas-bubble removal operation to reciprocate the agitating member (480) around a first position and a second gas-bubble removal operation to reciprocate the agitating member (480) around a second position different from the first position, during a bubble removing process for removing gas bubbles attached to the ionically resistive element (450).
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