PLATING APPARATUS
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Dec 18, 2024
filing date -
Dec 18, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
A plating apparatus includes a plating bath in which a plating solution is stored, a metal pipe having a cylindrical shape and including a hollow portion, the metal pipe defining and functioning as a first electrode, a mesh pipe having a cylindrical shape and including a hollow portion, the mesh pipe being made of an insulating material, and a second electrode. The metal pipe, the mesh pipe, and the second electrode are accommodated in the plating bath, the metal pipe is located inside the hollow portion of the mesh pipe, a plating forming portion is provided between an inside of the mesh pipe and an outside of the metal pipe, the second electrode is located outside the mesh pipe, and an upward flow with which the plating solution is moved upward is generated inside the hollow portion of the metal pipe.
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