PLATING APPARATUS

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250116024A1
SERIAL NO

18984870

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A plating apparatus includes a plating bath storing a plating solution and plating targets, and an injector in the plating bath. The injector includes a first injection port to inject the plating solution. The plating targets included in the plating solution are stirred by the plating solution injected from the injector. A mesh portion is provided at the first injection port. The mesh portion is defined by at least two stacked meshes. The mesh portion includes a central portion and a circumferential portion provided outside the central portion when viewed in a planar direction. The circumferential portion is defined by one layer of the mesh or a plurality of layers of the mesh. The central portion is defined by a plurality of layers of the mesh. A number of layers of the mesh in the central portion is greater than that of the circumferential portion.

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Patent Owner(s)

Patent OwnerAddress
MURATA MANUFACTURING CO LTD10-1 HIGASHIKOTARI 1-CHOME NAGAOKAKYO-SHI KYOTO-FU 617-8555

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
SHIMADA, Tomokazu Nagaokakyo-shi, JP 11 62

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