Thermal Interface Materials with Soft Filler Dispersions
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
N/A
Issued Date -
Apr 10, 2025
app pub date -
Dec 17, 2024
filing date -
Dec 17, 2024
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A heat transfer assembly utilizes a thermal interface material in a thermal dissipation pathway between a heat-generating component and a heat dissipater. The thermal interface material is disposed in a gap along the thermal dissipation pathway between a first surface and a second surface, wherein the gap has a mean gap width. The thermal interface material includes a matrix material and a particulated metal filler dispersed in the metal matrix, wherein the particulated metal filler has a melting point temperature of between 0° C. and 100° C., and a mean particle size that is equal to or greater than the mean gap width of the gap.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully