SLURRY COMPOSITION FOR CHEMICAL MECHANICAL METAL POLISHING AND POLISHING METHOD USING THE SAME

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United States of America

APP PUB NO 20250115785A1
SERIAL NO

18771727

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Abstract

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A slurry composition for chemical mechanical metal polishing includes a corrosion inhibitor, abrasive particles, an oxidizing agent, and a solvent. The corrosion inhibitor includes a C2 to C30 aliphatic heterocyclic compound including at least one nitrogen atom in the ring and at least one functional group selected from a halogen, an amine group, a cyclic amine group, a nitro group, an amide group, a carboxyl group, a hydroxy group, a thiol group, an alkoxy group, a C10 to C30 alkyl group, or an ester group; or a C2 to C30 aromatic heterocyclic compound including at least one nitrogen atom in the ring and at least one functional group selected from a halogen, an amine group, a cyclic amine group, a nitro group, an amide group, a carboxyl group, a hydroxy group, a thiol group, an alkoxy group, a C10 to C30 alkyl group, and an ester group; or a combination thereof.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDSUWON-SI

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHOI, Jaekwang Suwon-si, KR 4 26
HUR, Wonki Suwon-si, KR 3 0
KIM, Gayoung Suwon-si, KR 27 49
KIM, Inkwon Suwon-si, KR 11 24
KIM, Sangkyun Suwon-si, KR 34 602
KIM, Seokjoo Seongnam-si, KR 3 10
PARK, Sanghyun Suwon-si, KR 82 222
SONG, Eunho Suwon-si, KR 7 0
YANG, Daehoon Seongnam-si, KR 1 0

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