FUSION BONDING WAFER, TUBE FUSION BONDING DEVICE, AND TUBE FUSION BONDING METHOD
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Dec 17, 2024
filing date -
Dec 17, 2024
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Abstract
A fusion bonding wafer includes a first substrate formed in a flat plate shape, a second substrate joined to an inner surface of the first substrate, a heating element formed between the inner surface of the first substrate and an inner surface of the second substrate, and a temperature measurement hole that penetrates through the second substrate in a thickness direction thereof and exposes the inner surface of the first substrate.
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