SEAMLESS BUTTED LAMINATED BAMBOO LUMBER AND BUTTING METHOD THEREOF

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250114964A1
SERIAL NO

18502923

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Abstract

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Disclosed is a splicing method for seamless butted laminated bamboo lumber (LBL), falling within the technical field of LBL. According to the present disclosure, positions needing to be spliced on end faces of bamboo materials are applied with glue adhesive, and butted by tenon-mortise structures, the tenon-mortise structure being at least one of a semicircle, a semi-ellipse, a V-shape and a U-shape. An included angle between a plane at a top of the V-shape and the end face of the bamboo material is greater than 14° when a single V-shape is adopted. According to the present disclosure, by butting the bamboo materials, products with any length, width and thickness can be produced, and the produced products are seamless, which improves the strength and stability of the products.

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Patent Owner(s)

Patent OwnerAddress
GAO SHIQING100176 BUILDING 2 YARD 2 DESHENG NORTH STREET YIZHUANG ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE DAXING DISTRICT BEIJING MUNICIPAL DISTRICT BEIJING CITY 100176

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gao, Shiqing Wenzhou, CN 4 8
Gao, Yonghui Wenzhou, CN 3 2

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