METHOD OF PROCESSING WORKPIECE
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Sep 24, 2024
filing date -
Sep 24, 2024
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Abstract
A method of processing a workpiece using a chuck table, a grinding unit, a polishing unit, and a measuring unit includes a grinding step of grinding the workpiece with the grinding unit, a measuring step of measuring thicknesses of the workpiece at a plurality of measurement sites and acquiring information with respect to a thickness distribution of the workpiece with the measuring unit, and a polishing step of polishing the workpiece with the polishing unit. The polishing step includes determining polishing conditions based on the information with respect to the thickness distribution of the workpiece acquired in the measuring step and polishing the workpiece under the determined polishing conditions.
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