LASER CUTTING DEVICE AND LASER CUTTING METHOD USING THE SAME

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250114871A1
SERIAL NO

18742137

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Abstract

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A laser cutting device includes: a light source part configured to emit a laser beam; a stage on which a workpiece is placed; an optical system including a scanning unit configured to irradiate the laser beam to the stage and change an irradiation direction of the laser beam along a shape set for the workpiece, and optical devices disposed on a path of the laser beam, which is from the light source part to the scanning unit; and an optical path selection part disposed between the light source part and the optical system and configured to adjust the path of the laser beam so that the laser beam moves to one of the optical devices.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG DISPLAY CO LTD1 SAMSUNG-RO GIHEUNG-GU YONGIN-SI GYEONGGI-DO 17113

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LEE, Inho Yongin-si, KR 18 107
RYU, Je Yun Yongin-si, KR 2 1

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