Method for determining a position of a workpiece in a processing chamber of a laser plotter for cutting, engraving, marking and/or lettering the workpiece, and method for calibrating and laser plotter therefor
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Sep 27, 2022
filing date -
Sep 27, 2022
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Abstract
The present disclosure relates to a laser plotter and a method for calibrating as well as a method for determining a position of a workpiece in a processing chamber of a laser plotter for cutting, engraving, marking and/or lettering the workpiece. At least one beam source in the form of a laser is used in a housing of the laser plotter, whereby the workpiece is placed on a processing table and the position of at least one inserted workpiece on the processing table or in the processing chamber is detected via at least one camera. At least one camera for the processing chamber is integrated into a lid of the laser plotter, whereby detection of the position of the inserted workpiece or the processing chamber, such as the ruler, is performed both when the lid is open and when it is closed.
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